Metallized ceramic substrates combine high-adhesion metal conductor layers with ceramic base materials, integrating the excellent insulation and thermal properties of ceramics with the high conductivity of metal traces. They are widely used in power electronics, semiconductor packaging, and high-frequency circuit applications.

Taiwan Ceramics Company offers two metallization processes — DPC and Thick Film Printing — to meet customers' design specifications and application requirements.

Metallization Processes:

• DPC (Direct Plating Copper) — Uses thin-film sputtering and electroplating technology for high circuit precision, ideal for fine-pitch and miniaturized designs with excellent surface flatness and chip bonding compatibility

• Thick Film Printing — Screen-printed conductor paste on substrate offering flexible process capability for multilayer circuit designs; conductor materials include silver, silver-palladium, and gold, widely used in hybrid circuits and sensor modules