Taiwan Ceramics Company (TCC)
Sub-Mount for Laser Diode
A sub-mount is a commonly used structure in electronic component packaging technology.
It typically refers to an intermediate substrate or carrier used to support or fix a chip, such as a semiconductor chip, LED chip, or laser diode.
The sub-mount serves as a bridge between the chip and the external circuit board.
Why Sub-Mounts Matter in Laser Modules
In high-power laser modules, the sub-mount plays a critical role in ensuring performance, reliability, and lifetime.
Our high-thermal-dissipation ceramic sub-mounts are designed for CoS (Chip on Sub-mount) assemblies in high-power laser diode modules used in optical communication (e.g., TOSA, SOA), industrial lasers, medical lasers, sensing and measurement systems, consumer electronics, as well as military and research applications.
We carefully select substrate materials such as AlN (Aluminum Nitride) and SiC (Silicon Carbide), apply precise metal layers, and perform advanced surface treatments to ensure optimal performance in key areas:
Thermal Management
Efficient heat dissipation is critical. Our sub-mounts, made from high thermal conductivity materials like AlN and SiC, help transfer heat away from the laser diode, maintaining optimal operating temperatures.
Mechanical Stability
Precision mounting and robust mechanical support prevent misalignment and stress-induced degradation during thermal cycling and long-term operation.
Electrical Integration
Sub-mounts provide reliable electrical pathways and serve as platforms for wire bonding and die attachment in compact, high-power modules.
At Taiwan Ceramics Company, we understand the importance of every detail in laser diode packaging.
Our advanced ceramic sub-mount solutions are engineered to meet the demanding requirements of optical communication, medical, industrial, and scientific laser applications.
